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MPU-6050 Accelerometer Gyroscope Sensor Module

$3.02$26.67

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  • Integrates 3-axis gyroscope and 3-axis accelerator, including the hardware accelerator engine for devices connected to the second I2C port, like another accelerator of other brands, magnetometer, or Digital Motion Processor (DMP) of other sensors
  • With three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs and another three ones for digitizing the accelerometer outputs
  • Tri-Axis angular rate sensor (gyro) with a sensitivity up to 131 LSBs/dps and a full-scale range of ±250, ±500, ±1000, and ±2000dps
  • Tri-Axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g
  • Transmission can pass I2C up to 400kHz or SPI up to 20MHz
  • Working voltage: 2.375V–3.46V VLOGIC (MPU-6050) at 1.8V±5% or VDD

Product Description

The MPU-6050™ parts are the world’s first MotionTracking devices designed for the low power, low cost, and high-performance requirements of smartphones, tablets and wearable sensors.

The MPU-6050 incorporates InvenSense’s MotionFusion™ and run-time calibration firmware that enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices in motion-enabled products, guaranteeing that sensor fusion algorithms and calibration procedures deliver optimal performance for consumers.

Features

  • Gyroscope Features
  • The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:
  • Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full
    scale range of ±250, ±500, ±1000, and ±2000°/sec
     External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
     Integrated 16-bit ADCs enable simultaneous sampling of gyros
     Enhanced bias and sensitivity temperature stability reduces the need for user calibration
     Improved low-frequency noise performance
     Digitally-programmable low-pass filter
     Gyroscope operating current: 3.6mA
     Standby current: 5µA
     Factory calibrated sensitivity scale factor
     User self-test
  • Accelerometer Features
  • The triple-axis MEMS accelerometer in MPU-60X0 includes a wide range of features:
     Digital-output triple-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and
    ±16g
     Integrated 16-bit ADCs enable simultaneous sampling of accelerometers while requiring no external
    multiplexer
     Accelerometer normal operating current: 500µA
     Low power accelerometer mode current: 10µA at 1.25Hz, 20µA at 5Hz, 60µA at 20Hz, 110µA at
    40HzGyroscope Sensor Module 16Bit AD Conv
     Orientation detection and signaling
     Tap detection
     User-programmable interrupts
     High-G interrupt
     User self-test
  • Additional Features
  • The MPU-60X0 includes the following additional features:
  • 9-Axis MotionFusion by the on-chip Digital Motion Processor (DMP)
     Auxiliary master I2C bus for reading data from external sensors (e.g., magnetometer)
     3.9mA operating current when all 6 motion sensing axes and the DMP are enabled
     VDD supply voltage range of 2.375V-3.46V
     Flexible VLOGIC reference voltage supports multiple I2C interface voltages (MPU-6050 only)
     Smallest and thinnest QFN package for portable devices: 4x4x0.9mm
     Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
     1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data in
    bursts and then go into a low-power mode as the MPU collects more data
     Digital-output temperature sensor
     User-programmable digital filters for gyroscope, accelerometer, and temp sensor
     10,000 g shock tolerant
     400kHz Fast Mode I2C for communicating with all registers
     1MHz SPI serial interface for communicating with all registers (MPU-6000 only)
     20MHz SPI serial interface for reading sensor and interrupt registers (MPU-6000 only)
  • MEMS structure hermetically sealed and bonded at wafer level
Sum

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